Interconnect & Packaging Research Group
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Contact
Addresses
Biography
Awards
Publications
Courses
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Paul S. Ho
Professor
Cockrell Family Regents Chair in Engineering V
Contact
Office: PRC-MER 2.206D, ETC 8.176
Phone: (512) 471-8961, 1-8940
Fax: (512) 471-8969
Email: paulho@mail.utexas.edu
Administrative Associate:Jo Ann Smith
Phone: (512) 471-8996
Office: PRC-MER 160/R8650
Email: joann@mer.utexas.edu
Education
- B.S., Mechanical Engineering, National Cheng Kung, University, Taiwan,
1957
- M.S., Physics, National Tsing Hua University, Taiwan, 1959
- Ph.D., Physics, Rensselaer Polytechnic Institute, New York, 1965
Biography
Dr. Paul S. Ho is the Director of the Laboratory for Interconnect and Packaging at The University of Texas at Austin. He received his B.S. degree in mechanical engineering from National Chengkung University, Taiwan; M.S. degree in physics from National Tsinghua University, Taiwan; and Ph.D. degree in physics from Rensselaer Polytechnic Institute. He joined the Materials Science and Engineering Department at Cornell University in 1966 and became an Associate Professor in 1972. In 1972, he joined the IBM T.J. Watson Research Center and has held a number of management positions. In 1985, he became Senior Manager of the Interface Science Department. In 1991, he joined the faculty at The University of Texas at Austin and was appointed the Cockrell Family Regents Chair in Materials Science and Engineering. His current research is in the areas of materials and processing science for interconnect and packaging for microelectronics. He received the Outstanding Alumni Achievement Award from National Chengkung University in 1992, the Michel Lerme Award from the International Interconnect Technology Conference in 1999 and the Thomas D. Callihan Award of the Dielectric Science and Technology Division, The Electrochemical Society 199th Meeting, Washington, D.C., March 25-30, 2001. He holds the inventorship of 11 U.S. Patents in microelectronics technology. He has edited six books and published extensively in the area of thin films and materials science for microelectronics. He is a Fellow of the American Physical Society, the American Vacuum Society and IEEE.
Awards
- Outstanding Alumni Achievement Award from National Chengkung University, 1992
- Michel Lerme Award from the International Interconnect Technology Conference, 1999
- Thomas D. Callihan Award of the Dielectric Science and Technology Division,
The Electrochemical Society 199th Meeting, Washington, D.C., March 25-30, 2001
Publications
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Courses
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