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Interconnect & Packaging Research Group
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The Interconnect & Packaging Laboratory is located at the J. J. Pickle Research Campus and is part of the Microelectronics Research Center, the Mechanical Engineering Department and the Texas Materials Institute of The University of Texas at Austin.

Director: Dr. Paul S. Ho / PRC-MER 2.206D / 512.471.8961 / 512.471.8969 Fax

Admin Associate: JoAnn Smith / PRC-MER 2.206D / 512.471.8996 / 512.471.8969 Fax
Address
Pickle Research Center,
MER Bldg. 160  Room 2.206D
Campus Mail Code: R8650
Austin, TX 78758
 Postal Mailing Address
Interconnect & Packaging Group
Univ. of Texas, PRC/MER
Mail Code: R8650
Austin, TX 78712-1100 		Express Mail Delivery
Interconnect & Packaging Group
Univ. of Texas, PRC, Bldg. 160
10100 Burnet Road
Austin, TX 78758

 

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  Last update: 3-07-2008 | Contact: Webmaster