Mechanical Engineering professor Paul S. Ho has been selected by the Institute of Electrical and Electronics Engineers (IEEE) as co-recipient of its 2017 Components, Packaging, and Manufacturing Technology Award.
IEEE is the world’s largest technical professional society, serving professionals involved in all aspects of the electrical, electronic and computing fields and related areas of science and technology. The award was established in 2002 to recognize outstanding contributions to the advancement of components, electronic packaging or manufacturing technologies.
Ho directs the Interconnect and Packaging Laboratory at The University of Texas at Austin. He joined the Cockrell School of Engineering faculty in 1991 and was appointed the Cockrell Family Regents Chair in Materials Science and Engineering.
Ho’s current research centers on the areas of materials and processing science for interconnect and packaging for microelectronics. His previous awards include the Outstanding Alumni Achievement Award from National Chengkung University, the Michel Lerme Award from the International Interconnect Technology Conference, the Thomas D. Callinan Award from the Electrochemical Society and the University Research Award from the Semiconductor Industry Association.
