News

The need for faster and smaller electronics has resulted in microelectronic components that produce progressively more heat. Thus, heat dissipation is an important issue, and one solution for cooling is to develop novel semiconducting materials with high thermal conductivity. The UT Austin team includes post-doc fellows Xi Chen and Jaehyun Kim, graduate students Sean Sullivan and Yuanyuan Zhou and professors Jianshi Zhou and Li Shi from the Cockrell School’s Department of Mechanical Engineering and Texas Materials Institute.