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Photo of Ho, Paul
Office Location: MER 2.206D, ETC 8.176

Paul Ho

Professor Emeritus

Department Research Areas:

Dr. Paul S. Ho is the Director of the Laboratory for Interconnect and Packaging at The University of Texas at Austin. He received his B.S. degree in mechanical engineering from National Chengkung University, Taiwan; M.S. degree in physics from National Tsinghua University, Taiwan; and Ph.D. degree in physics from Rensselaer Polytechnic Institute. He joined the Materials Science and Engineering Department at Cornell University in 1966 and became an Associate Professor in 1972. In 1972, he joined the IBM T.J. Watson Research Center and has held a number of management positions. In 1985, he became Senior Manager of the Interface Science Department. In 1991, he joined the faculty at The University of Texas at Austin and was appointed the Cockrell Family Regents Chair in Materials Science and Engineering. His current research is in the areas of materials and processing science for interconnect and packaging for microelectronics. He received the Outstanding Alumni Achievement Award from National Chengkung University in 1992, the Michel Lerme Award from the International Interconnect Technology Conference in 1999 and the Thomas D. Callinan Award from the Electrochemical Society in 2001. He holds the inventorship of 15 U.S. Patents in microelectronics technology. He has edited six books and published extensively in the area of thin films and materials science for microelectronics. He is a Fellow of the American Physical Society, the American Vacuum Society and IEEE.

Most Recent Publications
  1. Ryu, Suk-Kyu, Lu, Kuan-Hsun, Zhang, Xuefeng, Im, Jang-Hi, Ho, Paul S., and Huang, Rui, "Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects," IEEE Transactions On Device And Materials Reliability, Vol. 11, (March 2011), 1, pp. 35-43
  2. Zhang, Lijuan, Ho, Paul s., Aubel, Oliver, Hennesthal, Christian, Zschech, Ehrenfried, "Grain Structure Effect on Electromigration Reliability of Cu Interconnects with CoWP Capping Layers," Journal Of Materials Research, (2011)
  3. Wu, Zhuo-Jie, Luo, Zhiquan, Rastogie, Ashish, Stavchansky, Salomon, Bowman, Phillip D., and Ho, Paul S., "Micro-fabricated perforated polymer devices for long-term drug delivery," Biomedical Microdevices, Vol. 12, (2011), pp. 485
  4. Ashish Rastogi, Zhiquan Luo, Zhuojie Wu, Paul S. Ho, Philip D. Bowman, Salomon Stavchansky, "Development and characteristics of a scalable micro perforated drug delivery system capable of long term zero drug release," Biomedical Microdevices, (June 2010)
  5. Seung-Hyun Chae, Jie-Hua Zhao, Darvin R. Edwards, Paul S. Ho, "Effect of Dicing Technique on the Fracture Strength of Si Dies with Emphasis on Multimodal Failure Distribution," IEEE Transactions On Device And Materials Reliability, Vol. 10, (March 2010), 1, pp. 149-156
  6. Junjing Bao, Hualiang Shi, Huai Huang, and Paul S. Ho, "Oxygen plasma damage to blanket andn patterned ultralow-k surfaces," Journal Of Vacuum Science Technology, Vol. A, (March 2010), 28(2), pp. 207-215
  7. Xuefeng Zhang, Suk-Kyu Ryu, Rui Huang, Paul S. Ho, Junjun Liu, Dorel Toma, "Mechanical Stability of Air-gap Interconnects," Back End Of Line, (2010)
  8. Seung-Hyun Chae, Jie-Hua Zhao, Darvin R. Edwards, Paul S. Ho, "Characterization of the Viscoelasticity of Molding Compounds in the Time Doman," Journal Of Electronic Materials, Vol. 39, (2010), 4, pp. 419-425
  9. Paul S. Ho, Ehrenfried Zschech, Dieter Schmeisser, Moritz A. Meyer, Rene Huebner, Meike Hauschildt, Lijuan Zhang, Martin Gall, Matthias Kraatz, "Scaling effects on microstructure and reliability for Cu interconnects," International Journal Of Materials Research, Vol. ijmr-110264, (2010), 101 (2), pp. 216-226
  10. Brook Huang-Lin Chao, Xuefeng Zhang, Seung-Hyun Chae, Paul S. Ho, "Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints," Microelectronics Reliability, Vol. 49, (2009), pp. 253-263